FCB-5000R Full-Auto RFID Flip Chip Bonding Machine 类别：RFID Bonding Machine
产品简介：Full-Auto RFID Flip Chip Bonding Machine are using Visual System to locate the chip and the antenna, then curing the glue and check the lable. The whole machine include: antenna unwinding, antenna feed and bonding platform ,dispensing, flip chip, chip bonding,...
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FCB-5000R Technology Specifications
Bonding Speed：UPH Max.4.5K（According to antenna material）；
Bonding Accuracy：Within ±30 um；
Material Bandwidth：Roll Max.350mm; Lamella Max.350mm X 200mm；
Chip Dimension: 0.4mm x 0.4mm ~2mm x 2mm；
Wafer Dimension：8 Inch；
Wafer Expander：Auto Expander（Including hot wind）；
Visual System：4 pcs(Including a heat pressure position)；
Control Method and Power Supply ：IPC and PLC Control, 220VAC 50HZ；
Power：3KW；
Machine Dimension：About L3500mm * W1280mm（No Display） * H1900mm
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